SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Wise Road Capital considers $3 billion sale of semiconductor packaging firm UTAC
  • 0

Wise Road Capital considers $3 billion sale of semiconductor packaging firm UTAC

SemiMediaEdit
April 24, 2025

April 24, 2025 /SemiMedia/ — Private equity firm Wise Road Capital is weighing a potential sale of UTAC Holdings Ltd., a Singapore-based semiconductor packaging and testing company, in a deal that could be valued around $3 billion, according to people familiar with the matter.

The Beijing-headquartered firm has hired an external advisor to explore strategic options, though the process remains in its early stages. If completed, the transaction could mark a significant reshuffling in the global outsourced semiconductor assembly and test (OSAT) industry.

UTAC operates production facilities across Singapore, China, Indonesia, and Thailand, offering a range of backend semiconductor services including wafer-level and system-in-package testing. Its customer base spans major integrated device manufacturers (IDMs) and foundries across key global markets.

Wise Road Capital acquired UTAC in 2020 from Affinity Equity Partners and TPG as part of its effort to deepen investments in the semiconductor supply chain. The firm has positioned itself as a global investor focused on core semiconductor technologies and emerging advanced tech sectors.

As supply chains diversify and geopolitical pressures reshape the semiconductor landscape, packaging and testing capabilities have become increasingly strategic. The proposed sale signals growing capital market interest in OSAT providers that can offer both geographic resilience and technical sophistication.

Related

chip testing services Electornic parts supplier electronic components news Electronic components supplier OSAT market Semiconductor M&A semiconductor packaging UTAC Singapore Wise Road Capital
 IBM warns of chip supply risks, highlights Japan's Rapidus as key alternative
Previous
Littelfuse releases IXD2012NTR high-side and low-side gate driver for high-frequency power applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator