March 25, 2025 /SemiMedia/ — Taiwan Semiconductor Manufacturing Company (TSMC) will begin accepting orders for its 2nm process on April 1, with demand already surpassing that of 3nm. Key customers are lining up to secure initial production capacity.

TSMC is ramping up 2nm wafer output at its Kaohsiung and Baoshan fabs. Reports indicate that the company will hold an expansion ceremony at its Kaohsiung site on March 31, with the first batch of 2nm wafers expected to arrive at Baoshan by late April. Apple has secured the first orders and will use TSMC’s 2nm process to manufacture its A20 chip, designed for the iPhone 18 series set to launch in the second half of 2026. Other major customers, including AMD, Intel, Broadcom, and AWS, are also vying for 2nm capacity.

TSMC aims to reach a monthly output of 50,000 wafers by the end of 2025, with full-scale production at both Kaohsiung and Baoshan. While industry analysts estimate 2nm wafer costs at around $30,000 per unit, TSMC plans to launch its “CyberShuttle” service in April to help customers reduce expenses. This service enables multiple clients to test their chip designs on shared wafers, optimizing early-stage development costs.