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Broadcom Backs $63 Billion Financing for Anthropic AI Chips

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October 28, 2026

October 28, 2026 / SemiMedia / — Broadcom and financial partners Bank of America, Blackstone, Citi and Morgan Stanley have announced a $63 billion financing arrangement to support Anthropic’s deployment of AI computing capacity.

Under the October 26 announcement, a newly formed special purpose vehicle will purchase Broadcom XPU AI accelerators and networking solutions and lease them to Anthropic. Deliveries are expected to begin in calendar 2027 under a previously announced strategic compute capacity agreement.

Bank of America, Citi and Morgan Stanley are arranging the first-lien financing, while Blackstone is the sole provider of the committed portion of the second-lien financing. Broadcom will provide residual value support equivalent to the first-lien portion.

In an October 27 regulatory filing, Broadcom said its maximum potential liability under the support arrangement would be approximately $43 billion on an undiscounted basis upon deployment of the AI racks. The exposure increases as equipment is delivered and deployed and declines as the customer makes lease payments.

If the customer defaults, Broadcom can seek to limit its exposure by assuming the lease or arranging a sale of the equipment, among other remedies. The company described the support as a contingent liability it believes has a low probability of being triggered.

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