April 17, 2026 /SemiMedia/ — TSMC is accelerating its global 3nm capacity expansion as demand from artificial intelligence and high-performance computing continues to grow, executives said during an earnings call.

Chairman and CEO C. C. Wei said the company will not prioritize specific customers despite tight capacity, and will instead focus on maintaining balanced supply across its client base.

He noted that TSMC has traditionally expanded capacity after reaching targeted output at each node. However, strong demand from AI-related applications has changed that approach, prompting the company to increase investment earlier to support customer needs.

In Taiwan, TSMC is building a new 3nm fab at its Tainan GIGAFAB site, with mass production scheduled for the first half of 2027. In the United States, its second Arizona fab has been completed and will adopt 3nm technology, with production expected in the second half of 2027. In Japan, the second Kumamoto fab is also planned to support 3nm, targeting mass production in 2028.

TSMC said its capital spending this year is expected to be at the higher end of its $52 billion to $56 billion range, driven by demand from 5G, AI, and HPC applications.

Chief Financial Officer Wendell Huang said the elevated spending reflects long-term growth opportunities, adding that the company remains well positioned to capture demand tied to AI and advanced computing.