SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › TrendForce: Global production capacity of PMICs is expected to up 4.7%
  • 0

TrendForce: Global production capacity of PMICs is expected to up 4.7%

SemiMediaEdit
January 9, 2023

Jan. 9, 2023 /SemiMedia/ -- According to TrendForce's latest forecast, with the release of new production lines of DIM companies such as Texas Instruments, the global production capacity of power management integrated circuits will increase by 4.7% in the first half of 2023. In addition, due to continued weak demand, it is expected that the price of PMICs will continue to drop by 5-10% in the first half of 2023, while some industrial and automotive grades will not be affected.

According to TrendForce analysis, IDM still occupies a dominant position in the power management chip market, with a total market share of 63%, of which Texas Instruments ranks first with a market share of 22%.

In 2022, major IDM companies raised prices due to inflation, which further increased the average selling price. However, power management chips used in products including laptops, tablets, TVs, and smartphones have begun to cut prices since the third quarter of 2022, with a quarterly decline of 3-10%

TrendForce pointed out that the current average lead time for power management chips of fabless companies is 12 to 28 weeks, while that of IDM companies is 20 to 40 weeks for non-automotive grades, and more than 32 weeks for automotive grades.

Related

electronic components news Electronic components supplier Electronic parts supplier PMIC market Texas Instruments
Car sales plummeted in 2022 due to shortage of auto chips
Previous
NXP releases advanced automotive radar SoCs for next-generation ADAS and autonomous driving systems
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator