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Passive components market continues to expand, reports say
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Insider: Micron plans to increase prices for DRAM and SSD by 25%
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Malaysia captures 13% of global packaging, assembly and testing services market share
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TDK releases next-generation ultrasonic time-of-flight sensor for new mass market applications in IoT and robotics
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Shin-Etsu Chemical plans to build new factory to increase photoresist production capacity
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TDK launches hybrid polymer capacitors with extremely high ripple current capability
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TSMC will build third chip fab in the US
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Samsung to increase Texas chip investment to $44 billion, report says
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ST launches state-of-the-art on-chip digitally signed NFC tag to extend brand protection
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Infineon leads the automotive semiconductor market in 2023
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