SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Samsung to increase Texas chip investment to $44 billion, report says
  • 0

Samsung to increase Texas chip investment to $44 billion, report says

SemiMediaEdit
April 9, 2024

April 9, 2024 /SemiMedia/ -- According to reports, Samsung Electronics plans to increase its investment in Texas to approximately US$44 billion.

The report pointed out that most of Samsung's new expenditures will be in Tyler. Samsung Electronics has built a chip factory near existing local facilities and now plans to build another chip manufacturing plant and an advanced packaging plant.

According to previous reports, the United States plans to provide more than $6 billion in funding to Samsung to help it further expand its scale beyond the initially announced construction projects in the United States.

Related

electronic components news Electronic components supplier Electronic parts supplier SAMSUNG Samsung Texas Samsung Tyler
ST launches state-of-the-art on-chip digitally signed NFC tag to extend brand protection
Previous
TSMC will build third chip fab in the US
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Global Memory Revenue Forecast to Reach $837.3 Billion in 2026 as AI Lifts Market Share to 54%

Global Memory Revenue Forecast to Reach $837.3 Billion in 2026 as AI Lifts Market Share to 54%

August 31, 2026
0
Traditional Packaging Capacity Gap Could Exceed 20% in 2027 as AI Demand Spreads Beyond Advanced Packaging

Traditional Packaging Capacity Gap Could Exceed 20% in 2027 as AI Demand Spreads Beyond Advanced Packaging

August 31, 2026
0
AWS to deploy 2 million additional NVIDIA GPUs in 2027 and 2028

AWS to deploy 2 million additional NVIDIA GPUs in 2027 and 2028

August 28, 2026
0
AI memory race expands as Kioxia and Sandisk invest ¥5 trillion and Korean suppliers advance HBC

AI memory race expands as Kioxia and Sandisk invest ¥5 trillion and Korean suppliers advance HBC

August 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator