SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › SK hynix restructures CIS team
  • 0

SK hynix restructures CIS team

SemiMediaEdit
January 31, 2023

Jan. 31, 2023 /SemiMedia/ -- According to reports, SK Hynix has reorganized its CMOS image sensor (CIS) team in order to shift the focus from expanding market share to developing high-end products.

Sony is the world's largest producer of CIS components, followed by Samsung. Focusing on high-resolution and multi-function, the two companies jointly control 70% to 80% of the market, of which Sony has about 50% market share. SK Hynix is relatively small in this field and has in the past focused on low-end CIS with a resolution of 20 megapixels or less.

However, the company has already started supplying its CIS to Samsung in 2021, including its 13-megapixel CIS for Samsung's foldable phone and the 50-megapixel sensor for the Galaxy A series last year.

The report pointed out that the SK hynix CIS team has now created a sub-team to focus on the development of specific functions and characteristics of the image sensor.

Related

CMOS market electronic components news Electronic components supplier Electronic parts supplier SK Hynix SK hynix CIS
STMicroelectronics plans to spend $4 billion on expansion
Previous
TDK launches the most compact safety class S2 motor-run capacitors
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator