SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › SEAJ: Sales of semiconductor manufacturing equipment in Japan are expected to grow by 27% in fiscal 2024
  • 0

SEAJ: Sales of semiconductor manufacturing equipment in Japan are expected to grow by 27% in fiscal 2024

SemiMediaEdit
January 19, 2024

January 19, 2024 /SemiMedia/ -- The Semiconductor Equipment Association of Japan (SEAJ) recently stated that driven by new demands for artificial intelligence, Japan's semiconductor equipment sales are expected to soar 27% in the 2024 fiscal year starting in April this year, reaching 4.03 trillion yen (approximately US$27 billion).

The SEAJ, whose members include Tokyo Electronics, Advantest and Screen, said it expects that in addition to the recovery of wafer foundries and logic chip manufacturers, spending by memory chip manufacturers will recover significantly during the second half of fiscal 2023 ending in March this year. It is expected that the average annual compound growth rate will continue to remain at 10% by March 2026.

Toshiki Kawai, chairman of SEAJ and CEO of Tokyo Electronics, said new chips for generative AI and investments in AI-enabled servers will boost demand.

Reports indicate that Japanese chip equipment manufacturers' revenue in the 2023 fiscal year ending in March this year is expected to fall by 19%, slightly less than the 23% previously forecast in July last year, partly due to strong sales in the mainland Chinese market.

Related

electronic components news Electronic components supplier Electronic parts supplier Semiconductor manufacturing equipment market
AMD issues discontinuation statement for some products
Previous
Microchip releases multi-channel remote temperature sensors
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron secures AI vehicle memory deals with Qualcomm and auto suppliers

Micron secures AI vehicle memory deals with Qualcomm and auto suppliers

July 17, 2026
0
Powertech plans $400 million Broadcom PLP venture in Singapore

Powertech plans $400 million Broadcom PLP venture in Singapore

July 17, 2026
0
Mitsubishi Electric seeks September deal with Rohm and Toshiba on power chips

Mitsubishi Electric seeks September deal with Rohm and Toshiba on power chips

July 17, 2026
0
Montage, Renesas and Rambus raided in South Korea price-fixing probe

Montage, Renesas and Rambus raided in South Korea price-fixing probe

July 16, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator