SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Samsung aims to earn US$8.8 billion in profit from chip business in 2024, report says
  • 0

Samsung aims to earn US$8.8 billion in profit from chip business in 2024, report says

SemiMediaEdit
January 4, 2024

January 4, 2024 /SemiMedia/ -- According to reports, the price drop of memory chips after 2022 caused Samsung's semiconductor division to suffer a loss of US$10 billion in 2023. In 2024, Samsung hopes to reverse the situation and aims to obtain 11.5 trillion won (approximately US$8.8 billion) in operating profits from the chip business.

The report pointed out that artificial intelligence is becoming the driving force for Samsung's memory chip sales, and the demand for high-profit HBM (high-bandwidth memory) will increase as a result. The recovery of smartphones and PCs will also drive the growth of other DRAM demand.

Samsung's current share of the global HBM market is approximately 47%. Supply chain sources said there are even buyers willing to spend US$1 billion on HBM pre-orders.

In addition, Samsung is expected to continue cutting NAND production to further increase price-guaranteed profits.

Related

electronic components news Electronic components supplier Electronic parts supplier Samsung semiconductor
ROHM completes acquisition of new production site
Previous
IDC: Semiconductor market is expected to grow at 20% in 2024
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

VIS sees stronger second-half demand as foundry capacity remains fully utilized

VIS sees stronger second-half demand as foundry capacity remains fully utilized

June 1, 2026
0
TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
0
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator