SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ROHM plans to pay $2.16 billion for Toshiba acquisition
  • 0

ROHM plans to pay $2.16 billion for Toshiba acquisition

SemiMediaEdit
July 21, 2023

July 21, 2023 /SemiMedia/ -- According to Nikkei Asia, ROHM Semiconductor plans to provide a total of 300 billion yen ($2.16 billion) in funding to a consortium led by private equity firm Japan Industrial Partners (JIP) for the proposed acquisition of Toshiba Semiconductor.

ROHM Semiconductor decided at the recent board meeting that if the tender offer is successful, it will invest 100 billion yen in the investment fund led by JIP, and will also purchase 200 billion yen of preferred shares issued by affiliated companies established for the acquisition.

ROHM Semiconductor said its main goal is to participate in the privatization of Toshiba and help solve their problems.

Both ROHM Semiconductor and Toshiba make power semiconductor devices that help reduce power consumption in electric vehicles, appliances and other products. ROHM Semiconductor regards this area as a top priority, aiming to capture 30% of the global market share of silicon carbide power devices in fiscal year 2025.

ROHM Semiconductor said its business is highly compatible with Toshiba's semiconductor business and expressed interest in future cooperation. Potential areas of cooperation include materials procurement and semiconductor production.

Related

electronic components news Electronic components supplier Electronic parts supplier Rohm Semiconductor
Infineon expands CoolSiC™ MOSFET family for better thermal performance, power density and easier assembly
Previous
TDK releases new embedded motor controller for driving BLDC and BDC motors
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Soitec Sees Photonics-SOI Revenue More Than Doubling Above $200 Million as AI Wafer Demand Surges

Soitec Sees Photonics-SOI Revenue More Than Doubling Above $200 Million as AI Wafer Demand Surges

September 2, 2026
0
Samsung Electro-Mechanics Wins KRW 1.07 Trillion AI Server MLCC Deal, Its Largest Ever

Samsung Electro-Mechanics Wins KRW 1.07 Trillion AI Server MLCC Deal, Its Largest Ever

September 2, 2026
0
Qualcomm Begins Double-Digit Chip Price Increases From September 1 as Supply Chain Costs Rise

Qualcomm Begins Double-Digit Chip Price Increases From September 1 as Supply Chain Costs Rise

September 2, 2026
0
SEMI Forecasts Global Semiconductor Market to Exceed $1.5 Trillion in 2026 and $2 Trillion by 2030

SEMI Forecasts Global Semiconductor Market to Exceed $1.5 Trillion in 2026 and $2 Trillion by 2030

September 1, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator