Reuters quoted sources familiar with the matter as saying that Intel and the Italian government are stepping up negotiations on the construction of an 8 billion euro (approximately US$9 billion) semiconductor packaging plant. The investment accounts for 10% of Intel's 10-year European layout plan.

The report pointed out that Intel and Italian Prime Minister Mario Draghi are discussing a $9 billion packaging plant construction plan. The estimated investment will last for 10 years, starting from the day of construction.

The report added that Italy hopes that Intel can clearly explain its plan and formulate a series of favorable conditions in terms of employment and energy costs. If the negotiation between the two parties goes smoothly, the next step will be to select locations.

Intel declined to comment on the possible investment in the negotiations and added that it has not announced any planned changes.