SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Power outage at TSMC’s fab 14
  • 0

Power outage at TSMC’s fab 14

SemiMediaEdit
April 15, 2021

According to reports, a power outage occurred on the 14th at TSMC’s fab 14 in the Southern Taiwan Science Park, causing the foundry to halt part of its 40nm and other mature-node chip production.

After the power outage, TSMC issued an emergency statement stating that the diesel generator had been used to restore power immediately after the power outage.

The industry estimates that 30,000 wafers were affected by the power outage and the loss amount was approximately NT$1 billion (approximately US$35 million).

Industry insiders pointed out that the 30,000 wafers affected by the power outage may not all be scrapped. However, the specific damage still needs to wait for further evaluation by TSMC.

Related

electronic components news TSMC fab 12 TSMC power outage
Global semiconductor equipment sales surge 19% in 2020
Previous
TDK releases robust X2 capacitors for high-temperature requirements
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

SEMI Forecasts Global Semiconductor Market to Exceed $1.5 Trillion in 2026 and $2 Trillion by 2030

SEMI Forecasts Global Semiconductor Market to Exceed $1.5 Trillion in 2026 and $2 Trillion by 2030

September 1, 2026
0
Global Memory Revenue Forecast to Reach $837.3 Billion in 2026 as AI Lifts Market Share to 54%

Global Memory Revenue Forecast to Reach $837.3 Billion in 2026 as AI Lifts Market Share to 54%

August 31, 2026
0
Traditional Packaging Capacity Gap Could Exceed 20% in 2027 as AI Demand Spreads Beyond Advanced Packaging

Traditional Packaging Capacity Gap Could Exceed 20% in 2027 as AI Demand Spreads Beyond Advanced Packaging

August 31, 2026
0
AWS to deploy 2 million additional NVIDIA GPUs in 2027 and 2028

AWS to deploy 2 million additional NVIDIA GPUs in 2027 and 2028

August 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator