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onsemi to cut 200-300 jobs at Czech SiC wafer facility amid market adjustments

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June 10, 2026

June 10, 2026 /SemiMedia/ — onsemi has announced plans to reduce its workforce by 200-300 employees at its Roznov plant in the Czech Republic, primarily affecting its core silicon carbide (SiC) wafer production lines. This follows a previous 2025 workforce reduction of 170 employees and reflects broader changes in the global power semiconductor market driven by supply-demand adjustments and cost pressures.

The Roznov facility is a key European base for onsemi’s SiC operations, with a monthly wafer capacity exceeding 250,000 units and annual output over 1 billion power devices. The plant covers critical processes including silicon crystal growth, Si/SiC wafer polishing and epitaxy, and silicon chip manufacturing.

In 2024, onsemi announced plans to invest up to $2 billion in a vertically integrated SiC factory at Roznov, one of the largest private investments in Czech history, slated for production in 2027. CEO Hassane El-Khoury said at the time the expansion would create a Central European SiC supply chain to meet growing demand for advanced power electronics.

The recent workforce reduction indicates a strategic shift at Roznov, influenced by changes in global SiC supply-demand dynamics. As global SiC capacity expands and market conditions fluctuate, onsemi is reassessing staffing and production strategies to maintain operational efficiency and financial stability.

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