SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › NXP reorganizes its senior management team
  • 0

NXP reorganizes its senior management team

SemiMediaEdit
September 10, 2018

NXP recently announced the reorganization of its senior management team. According to NXP, the adjustment is mainly to enable the management team to better match the company's focus and growth strategy.

Kurt Sievers, Executive Vice President and General Manager of NXP Automotive, was immediately promoted to President of NXP Semiconductors. Under the new structure, Kurt Sievers will oversee all of NXP's lines of business.

Ruediger Stroh will step down as Executive Vice President and General Manager of NXP's Security and Connectivity business on September 30, 2018.

Jennifer Wuamett, Deputy General Counsel and Chief Intellectual Property Officer, will replace Guido Dierick as Executive Vice President and General Counsel of NXP Semiconductors. Guido Dierick served as General Counsel after retirement but remained as Country Manager for NXP Semiconductors in the Netherlands.

“This new structure follows the natural development of our strategy as we focus on secure connected devices through the automotive and industrial and IoT businesses, as well as in the mobile and communications infrastructure market, as technology changes accelerate, all of us focus vertical requires edge-to-node platforms and solutions to facilitate data analytics, machine learning and advanced services. By streamlining our organization, we will be able to better leverage our scale, facilitate cross-company collaboration and reduce management overhead, all These will help us unlock the full profit growth potential of our business," said NXP CEO Rick Clemmer.

Related

NXP
TTI appoints new Vice President of Global Accounts
Previous
Intel announces acquisition of NetSpeed Systems
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
onsemi expects to produce 200mm SiC wafers by 2025
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Murata Completes New Vietnam Production Building to Expand Coil Component Capacity

Murata Completes New Vietnam Production Building to Expand Coil Component Capacity

October 12, 2026
0
Renesas Launches First 100V E-mode GaN FET Family for AI Data Centers and Robotics

Renesas Launches First 100V E-mode GaN FET Family for AI Data Centers and Robotics

October 10, 2026
0
Vishay Launches 35W Automotive D2TO35S Power Resistor With Up to 9× Higher Dissipation

Vishay Launches 35W Automotive D2TO35S Power Resistor With Up to 9× Higher Dissipation

October 9, 2026
0
Microchip Launches 65V Digital Power Monitors for 48V Automotive and AI Data Center Systems

Microchip Launches 65V Digital Power Monitors for 48V Automotive and AI Data Center Systems

October 2, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator