June 13, 2025 /SemiMedia/ — Micron Technology said it plans to invest approximately $200 billion in U.S. manufacturing and R&D, expanding its original commitment by $30 billion. The investment aims to strengthen the company’s role in high-performance memory for AI applications, particularly high bandwidth memory (HBM), which is used in conjunction with AI accelerators such as those from Nvidia.

Of the total investment, $150 billion will go toward expanding U.S. manufacturing capacity, while $50 billion will support R&D. A significant portion of the additional $30 billion will fund advanced packaging technologies critical for producing HBM chips, one of the fastest-growing and most profitable segments of the memory market.

Micron's expansion includes building a new memory fab in Boise, Idaho, and modernizing its existing facility in Manassas, Virginia. Combined, these projects are expected to generate around 90,000 direct and indirect jobs.

The company is also expected to receive approximately $6 billion in funding under the CHIPS and Science Act to support its domestic capacity buildup. The U.S. government, under renewed pressure to secure favorable terms, has begun renegotiating agreements under the 2022 law, according to Commerce Secretary Howard Lutnick.

Lutnick pointed to TSMC’s decision to raise its U.S. investment by another $100 billion beyond its initial $65 billion pledge—without additional federal funding—as a benchmark. Apple, Microsoft, and other tech giants have also expanded their U.S. manufacturing footprints in response to government policy initiatives.

While some high-profile proposals—like SoftBank and OpenAI’s reported $500 billion AI project—have slowed, Micron is continuing to move forward with its long-term U.S. expansion plan, despite previous delays in execution.