October 21, 2026 / SemiMedia / — Samsung Electro-Mechanics has signed a KRW 360.5 billion long-term agreement to supply memory semiconductor package substrates to an undisclosed global customer. Announced on October 19, the contract covers deliveries from January 1 through December 31, 2027.

The agreement extends the company’s long-term supply arrangements from components into package substrates. Since May 2026, Samsung Electro-Mechanics has disclosed seven such agreements totaling approximately KRW 4.3 trillion, including contracts for silicon capacitors, AI server MLCCs and high-performance inductors.

The company said growing AI and high-performance computing demand is increasing requirements for advanced memory substrates. Faster, more highly integrated memory devices require higher layer counts, finer circuitry and thinner structures, placing greater demands on manufacturing precision and warpage control.

Separately, Samsung Electro-Mechanics announced investments in September totaling KRW 6.78 trillion: KRW 4.27 trillion at its Sejong site in South Korea and KRW 2.51 trillion at its Vietnamese subsidiary, supporting FC-BGA capacity expansion for AI servers.