SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel will receive $3.2 billion in Israeli funding to build chip factories
  • 0

Intel will receive $3.2 billion in Israeli funding to build chip factories

SemiMediaEdit
December 28, 2023

December 28, 2023 /SemiMedia/ -- According to reports, the Israeli government agreed on December 26 to allocate US$3.2 billion to Intel to build a US$25 billion chip factory in southern Israel.

Intel said that the expansion plan of the Kiryat Gat factory in Israel is an important part of Intel's efforts to promote a more resilient global supply chain, and is also an important part of the company's ongoing manufacturing investments in Europe and the United States.

The Israeli government's $3.2 billion in subsidies accounted for 12.8% of the total investment in the chip factory. In addition, Intel has also committed to purchasing goods and services worth 60 billion shekels (approximately $16.6 billion) from Israeli suppliers over the next ten years. New The factory is expected to create thousands of jobs.

Related

electronic components news Electronic components supplier Electronic parts supplier Intel Israel
KYOCERA AVX announces expansion of TWD high temperature Max-Cap Series wet tantalum capacitors
Previous
South Korean chip shipments soar 80% in November
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

VIS sees stronger second-half demand as foundry capacity remains fully utilized

VIS sees stronger second-half demand as foundry capacity remains fully utilized

June 1, 2026
0
TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
0
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator