October 10, 2026 / SemiMedia / — GlobalFoundries has signed a $2 billion manufacturing agreement with Taiwan Semiconductor Manufacturing Company (TSMC) to produce silicon interposers for CoWoS advanced packaging in the United States, marking a major step toward building a domestic AI semiconductor supply chain.

Under the agreement, GlobalFoundries will expand manufacturing capacity at its Malta, New York facility to support TSMC’s silicon interposer production. The initial agreement has a five-year term, with volume production expected to ramp in the first half of 2028.

Silicon interposers play a critical role in advanced AI packaging by connecting GPUs, AI ASICs and high-bandwidth memory (HBM). As demand for AI accelerators continues to rise, CoWoS packaging capacity has become one of the key bottlenecks in the AI semiconductor supply chain.

Unlike advanced logic chips produced on 2nm or 3nm nodes, silicon interposers mainly require high-density wiring, signal integrity and power delivery capabilities. GlobalFoundries’ existing silicon interposer platform uses 65nm technology, allowing the company to participate in the AI supply chain despite exiting leading-edge logic manufacturing.

The agreement will also support technologies such as deep trench capacitor (DTC) integration, which improves power delivery performance for advanced AI packages with increasing power requirements.

The move comes as the U.S. develops a broader domestic advanced packaging ecosystem. Amkor’s Arizona advanced packaging facility is expected to begin operations around early 2028, creating additional local capacity for AI semiconductor packaging.

TSMC is also expanding its U.S. manufacturing footprint. Its Arizona facility has already started 4nm production, while a 3nm fab is expected to begin production in the second half of 2027. The company is also planning advanced packaging capabilities in Arizona.

By connecting wafer manufacturing, silicon interposer production and advanced packaging within the U.S., the semiconductor industry aims to reduce supply chain distance for AI chips and improve manufacturing resilience.

Whether TSMC’s Arizona advanced packaging facilities can begin production earlier than originally planned remains uncertain. However, the expected 2028 timeline for multiple supply chain partners highlights the accelerating development of a U.S.-based CoWoS ecosystem.