SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › EU launches antitrust investigation against Broadcom
  • 0

EU launches antitrust investigation against Broadcom

SemiMediaEdit
July 2, 2019

The European Commission recently announced that it has launched an anti-monopoly investigation against Broadcom, which will assess whether Broadcom is obstructing market competition through an exclusive agreement and violating EU anti-monopoly laws.

Broadcom is a leader in single chip for set-top box and modem systems. The European Commission has questioned the exclusiveness of the contracts signed by Broadcom with seven customers, which may result in these customers only purchasing system single-chip, front-end chips and Wi-Fi chips from Broadcom. These exclusive rules will affect competition and innovation in these markets.

According to the information already collected by the European Commission, Broadcom has some improper operations. First, it has an exclusive procurement obligation with its customers; Second, when customers only buy chips from Broadcom or reach a certain amount of purchase, Broadcom will give the Customer rebate or other preferential terms; Third, improper bundling methods; Fourth, deliberately reduce the interoperability between Broadcom and other products. The above information allows the European Commission to initiate a formal investigation into whether Broadcom violates the anti-monopoly law.

Related

Broadcom electronic components news
Japan strengthens control over exports of semiconductor materials to South Korea
Previous
South Korea's response to Japanese semiconductor export controls
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator