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TDK releases next-generation ultrasonic time-of-flight sensor for new mass market applications in IoT and robotics
Shin-Etsu Chemical plans to build new factory to increase photoresist production capacity
TSMC will build third chip fab in the US
Samsung to increase Texas chip investment to $44 billion, report says
Infineon leads the automotive semiconductor market in 2023
Intel confirms layoffs in marketing and sales department
SIA: Global semiconductor sales up 16.3% year-on-year in February
Intel reveals $7 billion operating loss in foundry business
Samsung establishes new HBM improvement team
Japan announces $3.9 billion in subsidies to Rapidus
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