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Bosch to Establish Dedicated Semiconductor Division in 2028

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November 5, 2026

November 5, 2026 / SemiMedia / — Bosch will establish a dedicated Semiconductors division on January 1, 2028, as it seeks growth in markets including robotics and AI data centers. The chip business will move out of Mobility Electronics but remain within the Bosch Mobility business sector.

The company targets approximately €5 billion in semiconductor sales by 2030. It also plans to make more manufacturing capacity available to external partners and expand its foundry business.

Bosch intends to build on its MEMS sensor, silicon carbide and application specific IC capabilities. Semiconductor business head Erik Rein said the new organization would help align services with customer requirements across automotive, consumer electronics and other markets.

The reorganization is backed by manufacturing investment. Bosch has invested approximately €3 billion in its Dresden and Reutlingen wafer fabs in recent years and is spending about $2 billion to equip its Roseville, California, plant for specialized silicon carbide production.

The company also plans further expansion of its semiconductor test center in Penang, Malaysia, by the middle of the next decade. From 2028, Mobility Electronics will focus on electronic control units for automotive applications.

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