November 4, 2026 / SemiMedia / — Samsung Electronics has reportedly secured orders for HBM logic base dies at its planned second foundry fab in Taylor, Texas, with AMD accounting for most of the booked volume. Maeil Business Newspaper cited industry sources, while Samsung declined to confirm customer details.

The report said the fab’s planned output was already booked. It did not disclose an AMD contract value or an exact allocation of capacity to individual customers.

Samsung plans to manufacture base dies in Texas and combine them with DRAM core dies produced in South Korea to deliver complete HBM products. The base die provides the logic and interfaces that connect stacked memory with an accelerator.

Taylor Fab 2 is expected to cover about 2.7 million square feet, approximately 1.5 times the area of the first Taylor fab. Formal construction is scheduled to begin this month, equipment move-in from February 2029, and mass production in 2030 using a 2nm-class process, according to the report.

Nvidia’s sourcing strategy remains a separate question. Maeil reported that Nvidia wants its customized NVHBM base dies made at TSMC, while Samsung is evaluating whether its own foundry process could also support those products.

The reported AMD volume would provide a customer base for Samsung’s next phase of US foundry investment. The order allocation and production schedule have not been publicly confirmed by the companies.