November 10, 2026 / SemiMedia / — Terafab, the semiconductor manufacturing project backed by Tesla and SpaceX, has reportedly told equipment suppliers it aims to reach roughly 1 million wafers of monthly production capacity from 2032 onward. Nikkei reported that approximately 700,000 wafers would be allocated to memory chips and more than 300,000 to logic devices.

The proposed memory capacity alone would be comparable to Samsung Electronics' current DRAM capacity of approximately 650,000 to 700,000 wafers per month, according to an estimate cited by Wccftech. Terafab has not disclosed the product mix or detailed manufacturing arrangements for its memory operations.

Separately, Jiji Press reported that Intel is coordinating technical support for logic production, with its 2nm and 1.4nm processes under consideration. Cooperation with companies in Taiwan, China, on memory manufacturing is also being explored, but no specific partners or arrangements have been confirmed.

The planned production complex is in Grimes County, Texas. The state government announced in August that its first phase would involve more than $16.8 billion in capital investment and bring logic, memory and advanced packaging operations together.

At the November 6 Baron Investment Conference, investor Ron Baron suggested the broader Terafab effort could cost $1 trillion. Musk responded that spending would take place in phases. He also described a separate research fab at Tesla's Austin site, where he hopes to shorten chip development and testing cycles from about a year to a month before applying successful process changes to the production complex.

Musk previously targeted a working SRAM test chip at the Austin research facility around May or June 2027, followed by volume production in the third quarter of 2028. He described the schedule as very aggressive and acknowledged that production could instead begin in the fourth quarter. Equipment delivery, process development and the production ramp remain central to meeting those targets.