SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ST opens new SiC power device packaging line in Morocco
  • 0

ST opens new SiC power device packaging line in Morocco

SemiMediaEdit
June 22, 2022

According to reports, STMicroelectronics recently announced the opening of its new silicon carbide power device packaging production line for electric vehicles. The new production line is located in Bosquekura, Casablanca-Setat, Morocco.

The report pointed out that the expansion cost $244 million and expanded the factory's existing production area by 7,500 square meters, making it ST's second-largest factory.

From powder for making ingots, to SiC wafers and fabs in Catania, to chips packaged in Morocco, the new facility will be a key part of ST's strategy to supply SiC power device to Europe.

Related

electronic components news SiC device STMicroelectronics
TDK introduces ultra-thin patterned coils to revolutionize wireless charging
Previous
Semiconductor equipment lead time extended to 18 to 30 weeks
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TSMC to bring 3nm production to second Japan fab by 2028

TSMC to bring 3nm production to second Japan fab by 2028

April 3, 2026
0
Vishay launches first 8mm SMD-4 automotive MOSFET driver for EV systems

Vishay launches first 8mm SMD-4 automotive MOSFET driver for EV systems

April 3, 2026
0
MGC raises semiconductor materials prices 30% as packaging material costs rise

MGC raises semiconductor materials prices 30% as packaging material costs rise

April 3, 2026
0
DRAM pauses after rally as NAND extends gains, Q2 rebound expected

DRAM pauses after rally as NAND extends gains, Q2 rebound expected

April 2, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Electronic components distributor
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator