SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon's highly flexible and easy-to-design-in gate driver families now with reinforced isolation
  • 0

Infineon's highly flexible and easy-to-design-in gate driver families now with reinforced isolation

SemiMediaEdit
April 29, 2021

Infineon Technologies recently announced the expansion of its easy-to-design EiceDRIVER™ X3 Compact (1ED31xx) and the highly flexible EiceDRIVER X3 Enhanced Analog (1ED34xx) and Digital (1ED38xx) gate driver families. Both families now offer variants with superior reinforced isolation for higher application safety and long operating life. The new family members are VDE 0884-11 certified. With 8 mm wide-body packages, both families are suitable for applications with demanding isolation requirements including industrial drives, solar systems, uninterruptible power supplies, EV charging and other industrial applications.

The versatile EiceDRIVER X3 Compact family provides driving currents of 5.5, 10 and 14 A and optimized propagation delays of 90ns. The family also includes a Miller clamp that is highly recommended for SiC MOSFET 0 V turn-off. With these features, the 1ED31xx is suitable for high switching frequency applications, IGBT7 and power switches with voltage ratings up to 2300 V.

The EiceDRIVER X3 Enhanced Analog and Digital families offer precise and adjustable DESAT, as well as additional configurable parameters based on I 2C. This supports high flexibility in designs and reduces hardware complexity and evaluation time. Furthermore, the built-in monitoring functionality enables predictive maintenance.

Availability

The EiceDRIVER X3 Enhanced 1ED34xx and 1ED38xx as well as the EiceDRIVER X3 Compact 1ED31xx can be ordered now. More information is available at www.infineon.com/gdisolated.

Related

1ED34 1ED38 electronic components news Infineon
GM: chip shortage is the worst auto supply issue ever
Previous
VIS acquires AUO's fab to expand production capacity of 200mm
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator