SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › SK Hynix announces 176-layer NAND flash
  • 0

SK Hynix announces 176-layer NAND flash

SemiMediaEdit
December 8, 2020

SK Hynix announced that it has successfully developed 176-layer 4D NAND flash memory, which is the company's third-generation 4D NAND product.

SK Hynix said that compared with the previous generation of 128-layer products, the bit productivity of this product has increased by more than 35%, thereby enhancing cost competitiveness.

In addition, the product uses a new 2-division cell array selection technology, the cell reading speed is 20% higher than the previous generation, the data transmission rate is increased by 33%, and the transmission speed is 1.6Gb per second.

SK hynix has started sampling a 512Gbit TLC part to SSD controller companies for developing compatible firmware and plans to start mass production in the middle of next year.

Related

176 layer Nand flash electronic components news SK Hynix
Murata releases chip ferrite beads suitable for automotive applications up to 175°C
Previous
ST launches new highly integrated offline converter
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Sony to restart Kumamoto image sensor production in stages from August 4

Sony to restart Kumamoto image sensor production in stages from August 4

July 31, 2026
0
ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates

ASE raises 2026 capex to $10.5 billion as advanced packaging demand accelerates

July 31, 2026
0
UMC raises 2026 capex to $2 billion and expands Singapore and Tainan fabs

UMC raises 2026 capex to $2 billion and expands Singapore and Tainan fabs

July 30, 2026
0
GlobalFoundries signs $300 million U.S. silicon photonics funding LOI

GlobalFoundries signs $300 million U.S. silicon photonics funding LOI

July 30, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator