SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Dialog launches low-cost, high-efficiency Bluetooth SoC to capture opportunities in the IoT market
  • 0

Dialog launches low-cost, high-efficiency Bluetooth SoC to capture opportunities in the IoT market

SemiMediaEdit
December 9, 2019

In order to reduce the cost of IoT product development and speed up the design time, Dialog announced the launch of the new Bluetooth 5.1 system single chip "SmartBond TINY" (DA14531), which allows engineers to add BLE functionality to applications for as little as 0.5 US dollars, greatly simplifying Bluetooth product development and promoting wider applications.

According to Dialog, the number of devices that require wireless connectivity is increasing, but the cost of implementing a complete IoT system is under pressure. The main reason why most devices cannot be connected and intelligent is that the cost is too high. Therefore, Dialog takes cost reduction as the starting point and builds a Bluetooth SoC with lower cost but high performance.

Dialog started with fewer materials, fewer external components, smaller / cheaper batteries, and lower cost manufacturing to achieve a smaller, high-performance Bluetooth SoC with lower prices. With a production volume of 10 million units, the price can be as low as 0.5 US dollars. In addition, the company also launched the SmartBond TINY module, with a mass production volume of one million, the price of each module is only about $ 1, which can also reduce development costs.

It is reported that the size of the new product is 2.0 x 1.7 mm. It only needs six external passive components, a clock source and a power supply to form a complete Bluetooth low energy system. For developers, this means that SmartBond TINY can easily fit into any design, such as an electronic stylus, shelf label, beacon, or active RFID tag for asset management.

In short, the newly introduced Bluetooth SoC with small size and high performance successfully reduced system costs, solved the problem of increasing IoT devices and rising costs in a timely manner, and could extend wireless connectivity to the medical field, such as dispensers, scales, thermometers, blood glucose meters and more.

Related

DA14531 Dialog electronic components news IOT SmartBond TINY
IC Insights: IC market will resume growth next year
Previous
Intel will no longer pursue a high share of the CPU market
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

Foundry revenue slips in Q1 amid geopolitical rush orders; AI and China subsidies to lift Q2 outlook

June 11, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator