SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Toshiba appoints former Intel executives as CEO
  • 0

Toshiba appoints former Intel executives as CEO

SemiMediaEdit
October 16, 2018

Toshiba Memory Corporation recently announced the appointment of Stacy J. Smith as CEO. Effective October 1, 2018, Stacy J. Smith will work with Yasuo Naruke to take full responsibility for the company's business operations.

Prior to this, Smith has worked at Intel for 30 years and has been involved in a variety of fields. He has served as CFO for Intel for nearly a decade and is responsible for Intel's strategy, mergers and acquisitions and capital. From 2016 to 2018. During his tenure as President of Intel Production, Operations and Sales, Smith led 40,000 employees to achieve outstanding results in global production, technology development, supply chain, pricing and sales.

In addition, Smith has extensive board leadership experience. He currently serves as Chairman of the Board of Autodesk and Director of Metromile. He previously served as a director at Virgin America and GEVO.

Yasuo Naruke, President and CEO of Toshiba Memory Co., Ltd., said: "Stacy is excited to join Toshiba Memory as a key leadership position during the company's important development. Stacy has an extremely valuable international leadership experience. With a wealth of knowledge in the semiconductor industry, there is no doubt that he is the best person to help lead us as an independent company to the next stage of development."

Smith said: "I am very excited to be able to take on this responsibility. I am also honored to be a member of Toshiba Memory. Toshiba invented flash memory, and now Toshiba Memory is an independent company that can better focus on the development and development of semiconductor technology."

Related

Electronic component news Stacy J. Smith Toshiba appoints CEO
Taiwan MOSFET producers will benefit from trade wars
Previous
Texas Instruments Connect: Wi-Fi connected smart lock demo
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK launches HVC27*MC compact high-voltage DC contactor with mirror contact

TDK launches HVC27*MC compact high-voltage DC contactor with mirror contact

December 19, 2025
0
Vishay launches fast-acting thin film chip fuses for circuit protection

Vishay launches fast-acting thin film chip fuses for circuit protection

December 18, 2025
0
ROHM rolls out low-power DC motor driver ICs for appliance and industrial uses

ROHM rolls out low-power DC motor driver ICs for appliance and industrial uses

December 17, 2025
0
Infineon deepens 750V SiC push as packaging targets higher power density

Infineon deepens 750V SiC push as packaging targets higher power density

December 16, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator