SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › ADI introduces a new DSP that creates engine sound for electric and hybrid vehicles
  • 0

ADI introduces a new DSP that creates engine sound for electric and hybrid vehicles

SemiMediaEdit
July 23, 2018

Analog Devices has introduced an embedded system for generating engine sounds for electric (EV) and hybrid electric vehicles (HEV). The ADSP-BF706 digital signal processor and electric vehicle warning sound system (EVWSS) firmware enable automakers in North America and other global regions to comply with future safety regulations, requiring external engine sound for low-speed electric and hybrid vehicles.

The ADI solution includes a complete hardware and firmware reference design. It can be extended for high performance with the ADSP-BF706 or entry-level applications with the ADAU1450 digital audio processor. The ADSP-BF706 can also be used to create in-vehicle engine sounds that provide a better driving experience for the owner. The ADSP-BF706 uses memory-mapped quad SPI memory for faster, simpler access to stored audio files used to create engine sounds. Compared to traditional products, it can access up to 24 WAV files simultaneously, while traditional products usually only have 5 access.

ADI's Sigma Studio Integrated Development Environment (IDE) enables OEMs to graphically adjust audio sounds while using the ADAU1450. This allows sound engineers to optimize audio performance with minimal programming experience while reducing development time. The new Sigma Studio supporting the ADSP-BF706 will be available later this year. In addition, the ADSP-BF706 supports a low-cost CAN software stack to help customers quickly build automotive-grade prototypes.

For more information on the ADSP-BF706, please refer to the ADI website: www.analog.com

Related

ADAU1450 ADI ADSP-BF706 new DSP
GlobalFoundries accelerates its development in China
Previous
U-blox will use its own chip in its NB-IoT modules
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

Infineon rolls out isolated gate drivers to support next wave of SiC power systems

February 12, 2026
0
ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

ST launches Stellar P3E automotive MCU with on-chip AI acceleration for SDV platforms

February 11, 2026
0
TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

TDK rolls out stackable µPOL modules targeting AI server and ASIC power delivery

February 9, 2026
0
Taiyo Yuden announces new part number system for passive components

Taiyo Yuden announces new part number system for passive components

February 6, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator