April 1, 2026 /SemiMedia/ — Kioxia said in a notice to customers dated March 31 that it will discontinue a range of NAND flash products, including certain Floating Gate and BiCS FLASH gen.3 devices.

The products affected include devices built on older process nodes such as 32nm, 24nm and 15nm, covering SLC, MLC and TLC types in both wafer form and packaged products such as BGA, TSOP, eMMC and UFS.

Kioxia has set a timeline for the phase-out. The last time to place orders is scheduled for September 30, 2026, while final shipments are expected to be completed by December 31, 2028.

The company said the move is part of its product lifecycle planning and does not include items that had already been marked for discontinuation in earlier notices.

The change mainly affects earlier-generation NAND products, reflecting ongoing updates in product portfolios across the memory sector.