SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon launches USB-C PD MCU with integrated 55V controller for Li-ion charging
  • 0

Infineon launches USB-C PD MCU with integrated 55V controller for Li-ion charging

SemiMediaEdit
March 5, 2026

March 5, 2026 /SemiMedia/ — Infineon Technologies AG has introduced the EZ-PD PMG1-B2, a USB-C Power Delivery microcontroller designed for high-voltage lithium-ion battery charging in embedded systems.

The device integrates a 55V buck-boost controller and supports charging for 2- to 12-cell Li-ion battery packs. It complies with the latest USB Type-C and USB PD standards and supports an input voltage range from 4.5V to 55V.

The controller is built around a 32-bit Arm Cortex-M0 core with 128KB flash and 8KB SRAM. It also includes analog and digital peripherals such as ADC, PWM, UART, I²C and SPI interfaces, helping reduce external components and PCB space.

Infineon said the device targets applications powered through USB-C, including cordless tools, home appliances, e-bikes, e-scooters, drones and robotics systems.

The PMG1-B2 will also support a 240W USB-C PD 3.2 reference design developed with Arrow Electronics, combining the controller with PSOC C3 and 100V CoolGaN G5 transistors for compact battery-powered motor control systems.

Production of the EZ-PD PMG1-B2 is expected to begin in the second quarter of 2026. for more information please visit www.infineon.com/pmg1-b2.

Related

Electronic components distributor electronic components news embedded power management Infineon USB-C PD controller lithium battery charging IC USB Type-C power delivery MCU USB-C fast charging chip
Broadcom sees AI chip revenue surpassing $100 billion by 2027
Previous

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Broadcom sees AI chip revenue surpassing $100 billion by 2027

Broadcom sees AI chip revenue surpassing $100 billion by 2027

March 5, 2026
0
TrendForce sees NAND flash revenue jump on AI demand

TrendForce sees NAND flash revenue jump on AI demand

March 4, 2026
0
Rapidus wins Canon deal to prototype 2nm image chips

Rapidus wins Canon deal to prototype 2nm image chips

March 4, 2026
0
Vishay launches VOx619A optocouplers with 0.5 mA drive current

Vishay launches VOx619A optocouplers with 0.5 mA drive current

March 4, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator