SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch ›  NXP backs Israel’s RAAAM to boost on-chip memory innovation
  • 0

 NXP backs Israel’s RAAAM to boost on-chip memory innovation

SemiMediaEdit
November 12, 2025

November 12, 2025 /SemiMedia/ — NXP Semiconductors has led a $17.5 million Series A funding round for Israel-based on-chip memory startup RAAAM, marking a strategic move to enhance its presence in advanced semiconductor and AI computing technologies. The oversubscribed round lifts RAAAM’s total capital raised to more than $24 million.

RAAAM specializes in developing GCRAM, a next-generation on-chip memory technology that promises up to 50% smaller area and 90% lower power consumption compared with traditional SRAM. The investment will support RAAAM’s process validation across multiple leading foundries and accelerate collaboration with NXP on integrating GCRAM into future chip architectures.

Victor Wang, Vice President of Front-End Innovation at NXP, said RAAAM’s advances address a critical challenge in the semiconductor value chain and could improve AI and high-performance computing efficiency.

Founded in 2021, RAAAM operates from Israel with an R&D center in Switzerland. Its team of 22 was formed by four PhDs from Bar-Ilan University and EPFL, focusing on VLSI design and embedded memory systems. Co-founder and CEO Robert Giterman said GCRAM could significantly ease the memory bottleneck in AI chips by offering higher density and lower power operation.

Industry observers note that NXP’s involvement not only provides capital but also signals broader industry confidence in RAAAM’s technology, which could find applications in automotive and high-performance semiconductors in the coming years.

Related

AI chip design electronic components news Electronic components supplier Electronic parts supplier embedded system innovation low-power memory NXP Semiconductors on-chip memory RAAAM GCRAM semiconductor investment
Renesas unveils RRG5006x Gen6 DDR5 RCD to boost data center memory performance
Previous
Micron delays New York DRAM fab startup, shifts focus to Idaho
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Allegro to raise prices by at least 10% from late April

Allegro to raise prices by at least 10% from late April

March 27, 2026
0
Infineon rolls out XDPP1188-200C for AI server 800V power designs

Infineon rolls out XDPP1188-200C for AI server 800V power designs

March 27, 2026
0
Broadcom warns of supply limits as foundry capacity tightens

Broadcom warns of supply limits as foundry capacity tightens

March 26, 2026
0
Asus sees PC prices rising 25%–30% as chip costs increase

Asus sees PC prices rising 25%–30% as chip costs increase

March 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator