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Home › MarketWatch ›  NXP backs Israel’s RAAAM to boost on-chip memory innovation
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 NXP backs Israel’s RAAAM to boost on-chip memory innovation

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November 12, 2025

November 12, 2025 /SemiMedia/ — NXP Semiconductors has led a $17.5 million Series A funding round for Israel-based on-chip memory startup RAAAM, marking a strategic move to enhance its presence in advanced semiconductor and AI computing technologies. The oversubscribed round lifts RAAAM’s total capital raised to more than $24 million.

RAAAM specializes in developing GCRAM, a next-generation on-chip memory technology that promises up to 50% smaller area and 90% lower power consumption compared with traditional SRAM. The investment will support RAAAM’s process validation across multiple leading foundries and accelerate collaboration with NXP on integrating GCRAM into future chip architectures.

Victor Wang, Vice President of Front-End Innovation at NXP, said RAAAM’s advances address a critical challenge in the semiconductor value chain and could improve AI and high-performance computing efficiency.

Founded in 2021, RAAAM operates from Israel with an R&D center in Switzerland. Its team of 22 was formed by four PhDs from Bar-Ilan University and EPFL, focusing on VLSI design and embedded memory systems. Co-founder and CEO Robert Giterman said GCRAM could significantly ease the memory bottleneck in AI chips by offering higher density and lower power operation.

Industry observers note that NXP’s involvement not only provides capital but also signals broader industry confidence in RAAAM’s technology, which could find applications in automotive and high-performance semiconductors in the coming years.

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AI chip design electronic components news Electronic components supplier Electronic parts supplier embedded system innovation low-power memory NXP Semiconductors on-chip memory RAAAM GCRAM semiconductor investment
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