November 11, 2025 /SemiMedia/ — Taiwan Semiconductor Manufacturing Co (TSMC) has begun foundation work for a new fab in the Central Taiwan Science Park that will run 1.4nm production, according to filings submitted to local authorities. The project is part of Phase 2 expansion in Taichung and supersedes earlier assumptions that the site would be allocated to 2nm.

Engineering tenders for the fab buildings are underway. TSMC’s previously disclosed buildout plan indicated the site, designated as Wafer Fab 25, could ultimately support up to four 1.4nm fabs. The first module is planned to begin risk production by end-2027 and ramp to volume output in the second half of 2028. Supply chain sources have cited preliminary estimates of up to 50,000 wafers per month at maturity.

The shift reflects timing pressure from U.S. customers for next-generation nodes, while land development for TSMC’s next southern site progresses slower than expected — raising the possibility that even more advanced nodes may land in Taichung first.

The Taichung science park posted NT$1.04 trillion in revenue in 2024 (around US$32.5 billion), with integrated circuits accounting for more than 80% of total park revenue. The Phase 2 expansion has continued to pull in more semiconductor-related suppliers, reinforcing the region as TSMC’s core domestic cluster for advanced manufacturing.