October 24, 2025 /SemiMedia/ — STMicroelectronics has introduced a new family of 5-megapixel CMOS image sensors—VD1943, VB1943, VD5943, and VB5943—under its BrightSense product line, aimed at accelerating industrial automation, security, and smart retail applications.

A long-time leader in optical sensing, ST is leveraging its advanced 3D stacking and high-volume manufacturing capabilities to expand from consumer devices into industrial and embedded vision markets. The new sensors are designed to meet growing demands in machine vision, robotic guidance, biometric recognition, and automated inspection.

“The hybrid global and rolling shutter architecture enables users to capture motion-artifact-free and low-noise, high-detail images at the same time,” said Alexandre Balmefrezol, Executive Vice President and General Manager of ST’s Imaging Sub-Group. “This unique design provides unmatched flexibility and performance, making it ideal for high-speed automated manufacturing and object tracking.”

According to Dr. Florian Domengie, Principal Analyst for Imaging at Yole Group, the industrial and security imaging market is expected to reach USD 3.9 billion by 2030 with over 500 million units shipped, driven by advances in low-light performance, on-chip intelligence, and hybrid shutter technology.

The new VD1943, VD5943, VB1943, and VB5943 sensors are now available for sampling and evaluation, with mass production planned for February 2026. Featuring 2.25 µm pixel technology and 3D stacking, the sensors deliver high-resolution imaging in compact packages (10.3 mm × 8.9 mm) with an industry-leading 73% pixel-to-die ratio, ideal for space-constrained embedded systems.

The RGB-IR variants integrate on-chip RGB-IR separation, simplifying design by removing external components and supporting multiple output patterns, including 5MP RGB-NIR 4×4 and RGB Bayer modes. Independent exposure control and instant output switching enhance flexibility while maintaining full resolution for both visible and infrared imaging.

Using backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies, the sensors achieve high sensitivity and image clarity under low-light conditions. Single-frame on-chip HDR improves detail across bright and dark areas, enabling reliable imaging for machine vision, edge AI inspection, and intelligent monitoring systems.

For more information, please visit VD1943, VB1943, VD5943, and VB5943.