August 28, 2025 /SemiMedia/ — Infineon Technologies AG of Munich, Germany, has expanded its second-generation CoolSiC MOSFET 650V family with new 75mΩ devices, addressing growing demand for medium-power systems that require higher power density and compact layouts.

The new MOSFETs are offered in multiple package types including TOLL, ThinTOLL 8x8, TOLT, D2PAK, TO247-3 and TO247-4. Supporting both top-side cooling (TSC) and bottom-side cooling (BSC), the portfolio gives system developers greater design flexibility and scalability.

Compared with the previous generation, the CoolSiC G2 devices deliver improved performance metrics, higher reliability and easier system integration. They are well-suited for switching-mode power supplies (SMPS) in applications such as AI servers, renewable energy systems, electric vehicle chargers, humanoid robot power units, consumer electronics and industrial drives.

TOLL and ThinTOLL 8x8 packages provide strong thermal-cycle stability, enabling smaller PCB footprints and reducing system manufacturing costs. Their expanded application coverage supports designers in meeting cost and efficiency challenges in high-density power supply designs.

The addition of TOLT further enhances Infineon’s top-side cooling portfolio, which also includes CoolMOS 8, CoolSiC, CoolGaN and Optimos families. TSC variants enable up to 95% direct heat dissipation, allowing PCB designers to use both sides of the board while improving thermal performance and minimizing parasitics.

With this product expansion, Infineon strengthens its position in the power semiconductor market, providing OEMs and ODMs with highly efficient and flexible device options for next-generation applications.