SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Apple to produce chips at Texas Instruments’ new fabs
  • 0

Apple to produce chips at Texas Instruments’ new fabs

SemiMediaEdit
August 28, 2025

August 28, 2025 /SemiMedia/ — Apple will begin producing critical semiconductors at Texas Instruments’ (TI) new fabs in the United States, deepening its commitment to U.S. chip manufacturing.

TI has launched a $60 billion expansion plan that includes seven new fabs in Texas and Utah. The company’s Sherman site is expected to start full-scale production of 300mm wafers by late 2025.

Apple CEO Tim Cook said part of the company’s increased U.S. investment — raised to $600 billion over the next four years — will go toward manufacturing “critical foundation semiconductors” for iPhones and other devices at TI’s facilities.

Although TI does not produce advanced 2nm or 3nm chips, its analog and embedded products are essential for power management, sensing, automotive systems and industrial applications. The company remains the largest U.S. supplier of analog semiconductors, with components found in billions of electronic devices worldwide.

Industry analysts say Apple’s partnership with TI underscores Washington’s push to strengthen domestic semiconductor capacity. TI’s 300mm wafer production promises lower costs and greater efficiency, a move expected to encourage more customers to shift procurement toward U.S.-made chips.

Related

analog chips Apple chips chip production USA Electronic components supplier embedded chips iPhone semiconductors Semiconductor manufacturing Semiconductor supply chain Texas Instruments U.S. chip fabs
Infineon expands 650V CoolSiC G2 with 75mΩ MOSFETs for compact high-power designs
Previous
Toshiba partners with SICC to boost SiC power semiconductor supply and technology
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
Axelera AI raises $250 million to scale Europa inference chips

Axelera AI raises $250 million to scale Europa inference chips

February 26, 2026
0
Taalas raises $169 mln to push model-specific AI inference chips

Taalas raises $169 mln to push model-specific AI inference chips

February 25, 2026
0
Infineon says humanoid robots may drive future growth

Infineon says humanoid robots may drive future growth

February 25, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator