April 13, 2026 /SemiMedia/ — Samsung Electronics is in discussions with Vietnam’s finance ministry to sign a memorandum of understanding for a semiconductor project, marking a new step in its expansion in the country.

According to sources familiar with the matter, Samsung plans to invest about $4 billion to build a chip packaging and testing facility in northern Vietnam’s Thai Nguyen province. The project is expected to be carried out in phases, with an initial investment of around $2 billion.

The planned facility will focus on chip packaging, a key part of the semiconductor supply chain, as demand grows from data centers and artificial intelligence applications. Packaging has become increasingly important as chipmakers look to improve performance beyond wafer fabrication.

Samsung, one of Vietnam’s largest foreign investors, has built a broad manufacturing base in the country, covering smartphones, components, displays and research activities. Government data shows the company’s total investment in Vietnam has exceeded $23.2 billion as of 2024, supporting around 90,000 jobs.

If completed, the new plant would strengthen Vietnam’s role in the global semiconductor supply chain and support Samsung’s capacity expansion in chip packaging.