SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Renesas joins Wolfspeed’s restructuring plan, expects $1.7 billion impairment
  • 0

Renesas joins Wolfspeed’s restructuring plan, expects $1.7 billion impairment

SemiMediaEdit
June 25, 2025

June 25, 2025 /SemiMedia/ — Renesas Electronics said it has signed a Restructuring Support Agreement (RSA) with Wolfspeed and its primary creditors, as Wolfspeed prepares for court-supervised restructuring under Chapter 11 of the U.S. Bankruptcy Code. Renesas may record an impairment loss of up to ¥250 billion (approx. USD 1.7 billion) due to the revaluation of a previous deposit.

In 2023, Renesas committed a USD 2 billion deposit to Wolfspeed under a long-term silicon carbide (SiC) wafer supply agreement, later increased to USD 2.062 billion. Facing financial pressure, Wolfspeed disclosed in May 2025 that it may pursue an in-court restructuring and added going-concern language to its financial filings.

Under the new agreement, Renesas will convert its USD 2.062 billion deposit into a mix of Wolfspeed securities. This includes USD 204 million in convertible notes maturing in 2031, which would represent approximately 13.6% of Wolfspeed’s outstanding shares on a non-diluted basis, or 11.8% on a fully diluted basis. In addition, Renesas will acquire 38.7% of Wolfspeed’s common stock, equivalent to 17.9% on a fully diluted basis before warrant exercise, along with warrants representing a further 5% of the fully diluted share count.

Renesas expects the restructuring to close by the end of September 2025, pending court and regulatory approvals. If regulatory clearance is delayed, Renesas will hold instruments with equivalent economic rights until approvals are secured.

The company estimates a potential impairment loss of around ¥250 billion for the six months ending June 30, 2025. Final figures will be determined with its auditor and disclosed at a later date.

Related

automotive power devices Chapter 11 filing convertible notes electronic components news Electronic components supplier Electronic parts supplier Renesas semiconductor news SiC wafer deal Wolfspeed restructuring
Global semiconductor foundry 2.0 market sees 13% revenue surge in Q1
Previous
Global 300mm fab capacity to hit record by 2028 as chipmakers accelerate advanced node expansion
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Asia controls 75% of global chip capacity, set to keep lead in next five years

Asia controls 75% of global chip capacity, set to keep lead in next five years

September 26, 2025
0
Renesas launches RA8T2 MCUs to boost high-end motor control

Renesas launches RA8T2 MCUs to boost high-end motor control

September 26, 2025
0
Samsung set to capture over 30% of HBM market share in 2025

Samsung set to capture over 30% of HBM market share in 2025

September 26, 2025
0
Micron to begin HBM4 mass production in first half of 2026

Micron to begin HBM4 mass production in first half of 2026

September 25, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator