February 11, 2026 /SemiMedia/ — Micron has faced significant challenges in supplying HBM4 memory for NVIDIA’s next-generation Rubin architecture chips, according to a SemiAnalysis report released in early February 2026.

The main issue was pin rate performance. NVIDIA requires HBM4 data transfer speeds above 11Gbps, but Micron’s engineering samples fell short. The report noted performance limits in Micron’s Base Die design and slower adoption of advanced process nodes, causing thermal and speed bottlenecks.

As a result, first-year HBM4 orders are expected to shift entirely to South Korean suppliers, with SK Hynix taking roughly 70% and Samsung about 30%. Samsung has been aggressive in HBM4 development, reportedly ready to start deliveries in February 2026.

Micron remains part of NVIDIA’s ecosystem, supplying LPDDR5X memory for the Vera CPU on the Rubin platform. The company plans to redesign and validate its Base Die in Q2 2026, potentially returning for future Rubin Ultra or HBM4E production.