SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Micron forms new cloud storage unit to target AI data centers and HBM growth
  • 0

Micron forms new cloud storage unit to target AI data centers and HBM growth

SemiMediaEdit
April 22, 2025

April 22, 2025 /SemiMedia/ — Micron Technology has reorganized its business structure and launched a new “Cloud Storage Business Unit” aimed at addressing surging demand from hyperscale cloud providers for memory products tailored to AI workloads, particularly high bandwidth memory (HBM) chips.

The newly created unit will focus on supplying products for large-scale data centers and accelerating data-intensive AI processing through HBM technology — a critical component for AI GPUs, especially those from Nvidia. Micron is one of the three major global suppliers of HBM, alongside SK Hynix and Samsung Electronics.

Raj Narasimhan, who previously led Micron’s Compute and Networking Business Unit, will head the new cloud division. His former unit included memory products for data centers, PCs, graphics, and networking.

Micron's restructuring also includes the creation of three additional business units:

  • The Core Data Center Business Unit will support OEMs with DRAM and NAND products.
  • The Mobile and Client Business Unit will serve smartphones and consumer devices.
  • The Automotive and Embedded Business Unit will focus on automotive, industrial, and consumer markets.

All units will continue under the leadership of current Micron executives. The company said in March that its revenue forecast exceeded Wall Street expectations, driven by increasing demand for HBM used in AI servers — underscoring the strategic relevance of the realignment.

Related

AI data center memory AI memory market DRAM for AI electronic components news Electronic components supplier Electronic parts supplier HBM chips high bandwidth memory hyperscale storage solutions Micron business reorganization Micron cloud storage NAND for data centers
Tenstorrent to expand Japan engineering team sixfold amid chip design push
Previous
Samsung to end DDR4 production, shifts focus to DDR5 and HBM
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

Diotec launches SiC Schottky diode for fast MOSFET short-circuit protection

August 20, 2025
0
TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

TSMC sets $30,000 price for 2nm wafers, targets AI and HPC clients

August 20, 2025
0
SK Hynix strengthens balance sheet on booming HBM demand

SK Hynix strengthens balance sheet on booming HBM demand

August 20, 2025
0
Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

Littelfuse launches TMR-based magnetic angle sensors for precision industrial and automotive control

August 19, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator