April 2, 2025 /SemiMedia/ — Renesas Electronics has introduced the DA14533, its first automotive-qualified Bluetooth® Low Energy (BLE) system-on-chip (SoC). This compact SoC integrates a radio transceiver, Arm® Cortex®-M0+ microcontroller, memory, peripherals, and security features. Designed for low power consumption and simplified system integration, it is AEC-Q100 Grade 2 certified, making it ideal for tire pressure monitoring systems (TPMS), keyless entry, wireless sensors, and battery management in automotive and industrial applications.

Ultra-low power consumption for extended battery life

Building on Renesas’ industry-leading low-power SmartBond Tiny BLE SoC family, the DA14533 features advanced power management. Its integrated DC-DC buck converter dynamically adjusts output voltage to meet system requirements. Power consumption is among the lowest in its class, requiring only 3.1mA during transmission, 2.5mA during reception, and just 500nA in hibernation mode. These power-saving capabilities are crucial for battery-powered automotive systems like TPMS, where energy efficiency is critical.

Automotive-grade reliability and security

The DA14533 meets the stringent AEC-Q100 Grade 2 qualification, ensuring stable operation in harsh environments ranging from -40°C to +105°C. Compliant with Bluetooth Core 5.3, it includes the latest security features to protect automotive and industrial wireless communication systems against cyber threats.

Compact design for simplified integration

As the smallest automotive BLE SoC available, the DA14533 comes in a WFFCQFN 22-pin 3.5 x 3.5 mm package. It requires only six external components and supports single crystal oscillator (XTAL) operation, reducing engineering bill of materials (eBOM) costs. This compact design makes it easy to integrate into space-constrained systems, helping customers accelerate time-to-market.

“Our SmartBond Tiny SoC family has achieved significant success in the industrial market, with over 100 million units shipped,” said Chandana Pairla, VP of Connectivity Solutions at Renesas. “This new automotive-grade device expands Bluetooth LE applications in the automotive and industrial sectors, offering enhanced power efficiency and broader temperature tolerance for next-generation battery-powered systems.”

Key Features

  • Microcontroller: Arm® Cortex®-M0+ for standalone operation or data processing
  • Memory: 64KB RAM, 12KB One-Time Programmable (OTP) memory
  • Wireless: 2.4 GHz Bluetooth transceiver
  • Power Management: Integrated low-IQ DC-DC buck converter
  • Storage: Supports external SPI flash
  • Compact package: WFFCQFN 22-pin, 3.5 x 3.5 mm
  • Certification: Bluetooth Core 5.3, AEC-Q100 Grade 2 (-40°C to +105°C)

The DA14533 is available now, along with the Bluetooth Low Energy SoC Development Kit Pro, which includes a motherboard, daughterboard, and cables for application development. The daughterboard is also available separately. More information can be found at: www.renesas.com/products/wireless-connectivity/bluetooth-low-energy