April 2, 2025 /SemiMedia/ — United Microelectronics Corporation (UMC) has launched an expansion project for its Fab 12i in Singapore’s Pasir Ris Wafer Fab Park, with the first phase set to begin production in 2026. Once completed, the facility’s annual 12-inch wafer capacity will exceed 1 million units.

The expansion consists of two phases, with the first phase requiring a $5 billion investment and a planned monthly capacity of 30,000 wafers. UMC has also reserved space for a second phase. The new facility will feature 22nm and 28nm process technologies, making it one of the most advanced semiconductor foundries in Singapore. It will support high-end smartphone display chips, high-performance memory for IoT devices, and next-generation communication chips.

UMC stated that the expansion aims to address the increasing global demand for mature process node chips, particularly in the communications, automotive, AI, and IoT sectors. The project is also expected to create approximately 700 high-tech jobs in Singapore, including positions for process, equipment, and R&D engineers, further strengthening the country’s role in the global semiconductor supply chain.