March 26, 2025 /SemiMedia/ — STMicroelectronics (ST) has introduced a new generation of silicon photonics and BiCMOS silicon-germanium processes to enhance optical interconnects in data centers and artificial intelligence (AI) clusters. Production is set to ramp up in the second half of this year.

The rapid expansion of AI computing has driven an increasing demand for high-bandwidth, low-power optical interconnects. Data centers rely on hundreds of thousands of optical transceivers, which convert optical signals into electrical signals for seamless data flow between GPUs, switches, and storage systems. ST’s silicon photonics technology enables the integration of multiple complex components into a single chip, while its next-generation BiCMOS process provides ultra-high-speed, low-power optical connectivity, supporting data rates of 800 Gb/s and 1.6 Tb/s with improved energy efficiency.

ST plans to manufacture these technologies at its European 300mm wafer fabs, ensuring an independent and high-volume supply for the optical module industry. According to Rémi El-Ouazzane, President of ST’s Microcontrollers, Digital ICs, and RF Products Group, the company aims to become a key silicon photonics and BiCMOS wafer supplier for the data center and AI cluster markets. AWS VP Nafea Bshara noted that AWS is collaborating with ST to develop the PIC100 silicon photonics process, enhancing AI interconnect solutions. Market research firm LightCounting forecasts that the market share of silicon photonics-based transceivers will increase from 30% in 2024 to 60% by 2030.

ST’s new photonic integrated circuits (PICs) and BiCMOS processes will be produced at its Crolles facility in France. The PIC100 process supports 200 Gbps/lane bandwidth and integrates a 50 GHz modulator with an 80 GHz photodetector. To improve efficiency, ST employs optimized silicon waveguides with 0.4 dB/cm loss and silicon nitride (SiN) waveguides with 0.5 dB/cm loss. The adoption of edge coupler technology reduces fiber interface losses to below 1.5 dB, ensuring more efficient optical coupling.

STMicroelectronics is accelerating the commercialization of its silicon photonics and BiCMOS processes to support AI and data center infrastructure with high-speed optical interconnects. The European-based production strategy reinforces supply chain resilience and industry-wide efficiency improvements.