February 4, 2025 /SemiMedia/ — Rapidus is set to install up to 10 EUV (Extreme Ultraviolet) lithography machines at its Japan-based facilities to begin mass production of 2nm chips by 2027.

According to Rapidus CEO Atsuyoshi Koike, the company plans to equip its IIM-1 and IIM-2 semiconductor production facilities with these advanced EUV machines. The first EUV machine, intended for Japan, is expected to arrive at New Chitose Airport in December 2024, marking a significant milestone in Rapidus' growth and Japan's semiconductor industry revival.

While Koike did not specify an exact timeline for the installation of the EUV machines, it is expected that some of the machines will be set up at the IIM-1 facility in the coming years, with additional systems later installed at IIM-2.

Rapidus has not disclosed the exact EUV equipment to be used, but it is likely that the company will deploy ASML’s Twinscan NXE:3800E model at IIM-1. The Twinscan NXE:3800E is capable of processing up to 220 wafers per hour, or approximately 5,280 wafers per day, assuming optimal conditions. However, downtime for maintenance means this is an upper limit rather than the typical output.

Estimating the actual production capacity of the IIM-2 facility is challenging, but based on the number of EUV machines being installed, we can make a rough calculation. For 3nm processes, the total number of mask layers typically ranges from 100 to 120, with 20 to 25 of those being EUV layers. If Rapidus' 2nm process includes 20 EUV layers, it’s estimated that with five EUV machines running at full capacity, IIM-1 could support the production of approximately 17,000 to 20,000 wafers per month. This is a very rough estimate and actual output may vary.

Rapidus aims to begin 2nm trial production at IIM-1 in April 2025. By June 2025, the company plans to deliver 2nm chip samples to Broadcom, a major developer of AI and communication processors that collaborates with companies like Google and Meta. Rapidus targets full 2nm mass production at IIM-1 by 2027, with IIM-2 to follow later.