SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Xilinx and Daimler collaborate to develop artificial intelligence automotive applications
  • 0

Xilinx and Daimler collaborate to develop artificial intelligence automotive applications

SemiMediaEdit
June 28, 2018

Xilinx and Daimler AG announced that the two companies are collaborating to jointly develop a vehicle system which uses Xilinx’ artificial intelligence processing technology of automotive applications. This scalable solution is supported by the Xilinx automotive platform, which combines system-on-chip devices and AI acceleration software to bring high performance, low latency to embedded AI in today's automotive applications. And the industry's best power efficiency and many other outstanding features.

Xilinx and Daimler collaborate to develop artificial intelligence automotive applications-SemiMedia

As part of the strategic cooperation, deep learning experts at the Mercedes-Benz R&D center in Sindelfingen, Germany, and Bangalore, India are embarking on their own AI algorithms on Xilinx's highly flexible automotive platform. Xilinx AI processor technology will be commercialized by Mercedes-Benz to achieve the most efficient commercial use of neural networks.

 

Related

artificial intelligence automotive applications Daimler Xilinx
2018 Global DRAM and NAND price trend analysis
Previous
TSC announced the acquisition of ON Semiconductor's TVS product line
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

NXP launches 5nm S32N7 automotive SoC for centralized vehicle computing

NXP launches 5nm S32N7 automotive SoC for centralized vehicle computing

January 9, 2026
0
Texas Instruments expands automotive chip portfolio as vehicles shift to centralized computing

Texas Instruments expands automotive chip portfolio as vehicles shift to centralized computing

January 7, 2026
0
Samsung to resume P5 fab project in Pyeongtaek as memory cycle stabilises

Samsung to resume P5 fab project in Pyeongtaek as memory cycle stabilises

January 6, 2026
0
Taiyo Yuden rolls out compact automotive-grade power inductors

Taiyo Yuden rolls out compact automotive-grade power inductors

January 6, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator