SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Xilinx and Daimler collaborate to develop artificial intelligence automotive applications
  • 0

Xilinx and Daimler collaborate to develop artificial intelligence automotive applications

SemiMediaEdit
June 28, 2018

Xilinx and Daimler AG announced that the two companies are collaborating to jointly develop a vehicle system which uses Xilinx’ artificial intelligence processing technology of automotive applications. This scalable solution is supported by the Xilinx automotive platform, which combines system-on-chip devices and AI acceleration software to bring high performance, low latency to embedded AI in today's automotive applications. And the industry's best power efficiency and many other outstanding features.

Xilinx and Daimler collaborate to develop artificial intelligence automotive applications-SemiMedia

As part of the strategic cooperation, deep learning experts at the Mercedes-Benz R&D center in Sindelfingen, Germany, and Bangalore, India are embarking on their own AI algorithms on Xilinx's highly flexible automotive platform. Xilinx AI processor technology will be commercialized by Mercedes-Benz to achieve the most efficient commercial use of neural networks.

 

Related

artificial intelligence automotive applications Daimler Xilinx
2018 Global DRAM and NAND price trend analysis
Previous
TSC announced the acquisition of ON Semiconductor's TVS product line
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

Vishay expands AC03-CS resistor series with surface-mountable WSZ lead form

June 12, 2025
0
ROHM launches automotive-grade current sense amplifiers for high- and negative-voltage systems

ROHM launches automotive-grade current sense amplifiers for high- and negative-voltage systems

June 11, 2025
0
1
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator