SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Infineon announces collaboration with Stellantis on smart EV power architecture
  • 0

Infineon announces collaboration with Stellantis on smart EV power architecture

SemiMediaEdit
November 12, 2024

November 12, 2024 /SemiMedia/ — Infineon Technologies announced a new partnership with EV manufacturer Stellantis to develop an advanced power architecture for Stellantis’ electric vehicles.

The collaboration builds on the companies' previous relationship, which began in 2022, when Infineon started supplying silicon carbide (SiC) semiconductors to Stellantis. The latest agreement includes the supply of advanced power switches, SiC semiconductors, and microcontrollers, with reserved production capacity.

Infineon’s PROFET™ smart power switches will replace traditional fuses, reducing wiring and enabling more efficient power management, making Stellantis’ EVs the first to feature an intelligent power network.

Additionally, Infineon’s CoolSiC™ silicon carbide semiconductors will enhance vehicle efficiency and performance, extending driving range while reducing costs. The AURIX™ microcontrollers will provide advanced power distribution capabilities for Stellantis' smart EV platform, STLA Brain.

As part of the partnership, Infineon and Stellantis will establish a Joint Power Lab to focus on developing scalable and intelligent power systems.

Infineon stated that its manufacturing facilities in Malaysia and Germany have sufficient capacity to meet market demand for automotive semiconductors and are prepared to scale up production as needed.

The collaboration aims to boost energy efficiency, driving range, and overall user experience for electric vehicles, with a shared goal of making EVs safer, cleaner, more affordable, and widely accessible.

Related

electronic components news Electronic components supplier Electronic parts supplier Infineon Stellantis
onsemi unveils Treo Platform for advanced power and sensing solutions
Previous
Samsung to boost HBM capacity with new fab set for completion in 2027
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Intel cuts 5,400 jobs in Oregon as restructuring continues

Intel cuts 5,400 jobs in Oregon as restructuring continues

July 18, 2025
0
SanDisk cancels $55 billion chip plant project in Michigan

SanDisk cancels $55 billion chip plant project in Michigan

July 18, 2025
0
Nexperia introduces MJPE BJT series in compact CFP15B package for automotive and industrial use

Nexperia introduces MJPE BJT series in compact CFP15B package for automotive and industrial use

July 17, 2025
0
SK Keyfoundry and LB Semicon co-develop 8-inch Direct RDL for power and automotive chips

SK Keyfoundry and LB Semicon co-develop 8-inch Direct RDL for power and automotive chips

July 17, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator