August 20, 2024 /SemiMedia/ -- Samsung Electronics plans to initiate the tape-out of its 6th generation High Bandwidth Memory (HBM4) by the end of this year, preparing for the mass production of 12-layer HBM4 products by the end of next year.

Tape-out is the final step in semiconductor design, where design schematics are handed over to a semiconductor foundry for production, including the creation of photomasks, hence the term Mask Tape-Out (MTO).

The earliest HBM4 test products are expected to be available by early next year, with final test products likely to be completed 3 to 4 months after tape-out. Samsung Electronics plans to refine the design and process based on the performance of the initial HBM4 products. Following this, product testing with key customers is expected. A Samsung Electronics official stated that details regarding the product roadmap and timeline are not yet available.

SK Hynix also plans to commence mass production of 12-layer HBM4 products in the second half of next year.