SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Toshiba launched bridging ICs for car infotainment application interface.
  • 0

Toshiba launched bridging ICs for car infotainment application interface.

SemiMediaEdit
June 26, 2018

Toshiba Electronics and Storage Devices Co., Ltd. announced the launch of a new series of video interface bridging ICs for automotive In-Vehicle Infotainment(IVI) applications.

Toshiba launched bridging ICs for car infotainment application interface.-SemiMedia

Most of the current solutions for IVI are to use smart phones and tablets’ system-on-chip (SoC) chips. However, it is not perfect match due to the connection standard of the displays and other devices is different. Therefore, the Toshiba new series will provide the display interfaces that are lacking on existing SoCs.

Toshiba's new series of video interface bridging ICs provide HDMI-to-MIPI CSI-2 (TC9590), MIPI CSI-2 and parallel interface (TC9591) interconversion, and MIPI DSI to LVDS (TC9592/3) and many other linear. Among them, in addition to the TC9590 with 0.8mm pitch 7x7mm LFBGA64 package, other products are used in VFBGA package with 0.65mm pitch and sizes between 5x5mm and 7x7mm.

The TC9592 provides a single-link (5-pair/link) LVDS output suitable for connecting SoCs to 24-bit UXGA 1600x1200 monitors. The TC9593 offers dual-link (5-pair/link) LVDS output with a resolution up to WUXGA 1920x1200 ideal for displays.

The TC9591 can be set to convert 154 MHz 24-bit parallel data to 4-channel MIPI CSI-2 or MIPI CSI-2 to 100 MHz 24-bit parallel data. The TC9590 supports HDMI 1.4a input and 4-channel MIPI CSI-2 output. Among them, TC9591XBG operating temperature range is -40 °C to 105 °C, other models -40 °C to 85 °C.

 

Related

car infotainment application interface Toshiba
NXP's Edge Computing 5 - Modular IoT Framework for Mesh Networks with ZigBee & Thread Nodes
Previous
ROHM introduces the NXP "i.MX 8M" dedicated power management IC
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

March 19, 2026
0
Infineon rolls out new VR chips for AI servers to boost power design

Infineon rolls out new VR chips for AI servers to boost power design

March 18, 2026
0
Texas Instruments launches MCU families with built-in NPU to expand edge AI use

Texas Instruments launches MCU families with built-in NPU to expand edge AI use

March 17, 2026
0
Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

March 13, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • Electronic components distributor

SemiMediaEdit

Administrator