SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Melexis launched a new chipset which integrates sensing and motor drive function
  • 0

Melexis launched a new chipset which integrates sensing and motor drive function

SemiMediaEdit
June 22, 2018

Melexis recently introduced a two-chip chipset, the MLX81325, which directly integrates sensing into drive electronics, simplifying the design of low-cost, high-performance automotive solutions and shortening the time to market. In addition, the chipset integrates induction and brush motor drive functions, it is an idea chipset for automotive applications such as seat movements, window lifts, and sunroofs.

The MLX81325 is an integrated smart motor pre-driver with local interconnect network (LIN) capability and protocol controller. The QFN32 32-pin, 5mm x 5mm package provides fine powerFET control for efficient, low-noise operation. Brush motor start and stop.

The integrated solution includes four FET PWM pre-drivers, 32k flash and 16k ROM. Built-in various diagnostic functions, current sensing enables smart anti-pinch protection. A total of eight I / O lines can be directly connected to the position sensor from Melexis to simplify system design.

Related

Melexis MLX81325
Micron’s net profit increased by 131% due to high market demand
Previous
Intel CEO resigned due to violation of company policy by having a relationship with a co-worker
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
Microchip launches military-grade plastic TVS devices for aerospace use

Microchip launches military-grade plastic TVS devices for aerospace use

January 15, 2026
0
Vishay expands transmissive sensor lineup for industrial and telecom encoder designs

Vishay expands transmissive sensor lineup for industrial and telecom encoder designs

January 13, 2026
0
Infineon launches low-power Wi-Fi 7 tri-radio chip targeting IoT devices

Infineon launches low-power Wi-Fi 7 tri-radio chip targeting IoT devices

January 12, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator